https://nanyte.com/photoresists/su-8-2002 · last updated 2026-09-28
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 2.0–2.9 µm
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Applications
- MEMS structural · High aspect ratio · Electroplating / molding
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| SU-8 2002 | 1000 | 2.9 | — |
| 2000 | 2.4 | — | |
| 3000 | 2.0 | — |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the square markers legended 'SU-8 2002' on Figure 1a 'SU-8 2000 Thickness vs. Spin Speed', p.2 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020. Three plotted markers at 1000, 2000 and 3000 rpm; no numeric table accompanies the chart. Reads are calibrated against the 0.2 µm axis ticks of the embedded chart image.
- Three speeds are plotted: 2.93 µm at 1000 rpm, 2.40 µm at 2000 and 2.01 µm at 3000.
- Kayaku's recommended program for the series: dispense 1 ml of resist per inch (25 mm) of substrate diameter, spread at 500 rpm for 5-10 s at 100 rpm/s, then spin at 2000 rpm for 30 s at 300 rpm/s, choosing the final speed from the spin chart.
- Remove the edge bead with EBR PG so the mask can seat in close contact.
- Adhesion
- HMDS not required — 'Adhesion promoters are typically not required.' Clean and dry the substrate first — piranha (H2SO4 and H2O2) with a DI rinse, or RIE or an oxygen barrel asher. For applications that include electroplating, an HMDS pre-treatment is recommended.
Soft bake
- Soft bake
- 95 °C · hotplate
- Notes
- Times are set by film thickness: 0.5-2 µm → 1 min and 3-5 µm → 2 min at 95 °C; the table skips 2-3 µm, which is where this grade coats, so use 1-2 min and confirm with the wrinkle test. Use a level hotplate — convection ovens are not recommended because a skin can form and trap solvent. To check the bake, cool the wafer to room temperature and return it to the hotplate; if the film wrinkles, bake a few more minutes and repeat until it does not.
SOURCE: Table 2 'Soft Bake Times', p.3 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Exposure dose
SU-8 2002's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the film you spin, not the grade name: the table gives 60-180 mJ/cm² for 0.5-2 µm and 90-105 mJ/cm² for 3-5 µm, and has no row for the 2-3 µm films this grade makes. On glass and most metals multiply by 1.5-2.
- Post-exposure bake
- 95 °C · hotplate
| Film thickness | Dose |
|---|---|
| 0.5–2 µm | 60–180 mJ/cm² |
| 3–5 µm | 90–105 mJ/cm² |
| 6–15 µm | 110–140 mJ/cm² |
| 16–25 µm | 140–150 mJ/cm² |
| 26–40 µm | 150–160 mJ/cm² |
SOURCE: SU-8 2000 2000.5-2015 Technical Data Sheet
Table 3 'Exposure Dose', p.3 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020 — indexed by film thickness and shared by the six grades that sheet covers; no wavelength is attached to the table.
Development
- Developer
- SU-8 Developer; ethyl lactate or diacetone alcohol may also be used
- Method
- immersion, spray or spray-puddle
- Rinse
- Spray and wash the developed image with fresh SU-8 developer for about 10 s, then air-dry with filtered pressurised air or nitrogen.
- Developer family
- Solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: SU-8 2000 2000.5-2015 Technical Data Sheet
Development section and Table 6 'Development Times for SU-8 Developer', p.4 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Hard bake, etch & strip
- Hard bake
- 150–250 °C · 5–30 min (optional — when the resist stays on the device)
- Descum
- Not published — characterize on-tool
- Etch resistance
- Not characterised as an etch mask. Once cross-linked the film is described as chemically and thermally stable — 315 °C at 5 % weight loss, a glass transition of 210 °C — and extremely difficult to remove with solvent strippers.
- Stripper
- Minimally cross-linked SU-8 2000 swells and lifts off in Remover PG at 50-80 °C for 30-90 min; with a 30-100 nm OmniCoat underlayer the lift-off is clean. Fully cured or hard-baked SU-8 2000 cannot be removed without OmniCoat. To rework fully cross-linked films: piranha, plasma ash, RIE (200 W, 80 sccm O2, 8 sccm CF4, 100 mTorr, 10 °C), laser ablation or pyrolysis.
- Storage
- Store upright in tightly closed containers in a cool, dry place away from direct sunlight, light, acids, heat and ignition sources, at 4-21 °C (40-70 °F). Shelf life is thirteen months from date of manufacture.
SOURCE: Hard bake (cure) section, p.5 of the SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020
Where it's used
Practical notes from the datasheet
SU-8 2002 fills the gap between the sub-micron 2000.5 and the 2005 grade, making permanent epoxy films of two to three microns. One quirk of the sheet matters for this grade specifically: its bake, dose and develop tables jump from a 0.5-2 µm row to a 3-5 µm row, and most SU-8 2002 coats fall between them. Development is 1 minute either side of the gap, so that step is unaffected, but bake and dose have to be bracketed — start between the two rows and let the latent image and the wrinkle test tell you when it is right. Kayaku's check for exposure is a visible mask image within a minute of the 95 °C post-exposure bake. As with every SU-8 2000 grade, the cross-linked film is permanent; use OmniCoat if it must be removed.
Grades in this family
Other grades in the SU-8 2000 series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for SU-8 2002, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
SU-8 2002 coats at 2–3 µm, but the bake and dose tables jump from 0.5–2 µm to 3–5 µm. Which row applies?
Neither exactly — SU-8 2002 runs from about 2.9 µm at 1000 rpm to 2.0 µm at 3000 rpm, which falls in the gap. Bracket it: soft bake 1 min (0.5–2 µm) to 2 min (3–5 µm) at 95 °C, exposure 60–180 or 90–105 mJ/cm², PEB 1–2 or 2–3 min at 95 °C; develop is 1 min in both rows. Then let the film tell you: the wrinkle test confirms the soft bake, and a mask image visible after 1 min of PEB confirms dose and bake.
SOURCE: SU-8 2000 (2000.5–2015) Technical Data Sheet
Kayaku SU-8 2000 (2000.5–2015) Technical Data Sheet, ver. 1, Aug 2020 — Figure 1a, p.2; Tables 2–3, p.3; Tables 5–6 and PEB note, p.4
Why are small holes and tight-pitch gaps in SU-8 2002 not clearing in the developer?
The 1 min immersion time for this thickness is only approximate — dissolution rate varies widely with agitation. Use strong agitation for high-aspect-ratio features, and for via or hole patterns and tight-pitch structures an ultrasonic or megasonic bath can help. Finish with a ~10 s spray of fresh SU-8 developer before drying with filtered air or nitrogen. SU-8 developer is the designed chemistry; ethyl lactate and diacetone alcohol are listed alternatives.
SOURCE: Kayaku SU-8 2000 (2000.5–2015) Technical Data Sheet, ver. 1, Aug 2020 — Development, Table 6 and Rinse and Dry, p.4
My SU-8 2002 sidewalls flare instead of standing vertical. What should I change on the exposure side?
Filter the short wavelengths. Kayaku recommends a long-pass filter that removes UV below 350 nm to get vertical sidewalls in SU-8 2000; with their suggested filter (Omega Optical PL-360-LP) the exposure time goes up by roughly 40 % to reach the optimum dose. Re-run the exposure matrix after adding the filter: the 2–3 µm film of SU-8 2002 sits between the 60–180 and 90–105 mJ/cm² table rows, and the datasheet expects an exposure matrix to set the optimum dose anyway.
SOURCE: Kayaku SU-8 2000 (2000.5–2015) Technical Data Sheet, ver. 1, Aug 2020 — Exposure and Table 3 Exposure Dose, p.3
There are fine surface cracks in my developed SU-8 2002. Can they be repaired?
Yes, with a short anneal. The datasheet notes that the hard-bake step is useful for annealing surface cracks seen after development, and recommends baking at 150 °C for a couple of minutes, regardless of film thickness. If the SU-8 2002 stays in the device, a fuller cure can follow: 150–250 °C for 5–30 min, set about 10 °C above the highest temperature the part will see in operation.
SOURCE: Kayaku SU-8 2000 (2000.5–2015) Technical Data Sheet, ver. 1, Aug 2020 — Hard Bake (cure) and note, p.5
Sources & disclaimer
- Kayaku Advanced Materials — SU-8 2002 datasheet (SU-8 2000, 2000.5-2015 Technical Data Sheet, ver. 1, August 2020) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.