https://nanyte.com/photoresists/kmpr-1010 · last updated 2026-09-28
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 10–27 µm
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1010 | 1000 | 27 | 500–645 mJ/cm² · 21–30 µm row |
| 2000 | 15 | 355–485 mJ/cm² · 12–20 µm row | |
| 3000 | 11 | 235–335 mJ/cm² · 5–11 µm row 355–485 mJ/cm² · 12–20 µm row within 10 % of a bracket edge | |
| 4000 | 10 | 235–335 mJ/cm² · 5–11 µm row |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the filled-circle trace legended KMPR 1010 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2. Four plotted markers; no numeric table accompanies the chart.
- Most of the range is spent in the first half of the sweep: 27 µm at 1000 rpm falls to 15 µm by 2000 rpm, then flattens to 11 and 10 µm at 3000 and 4000.
- So the thick end is where speed actually controls thickness, and anything under about 10 µm means dropping to KMPR 1005 rather than spinning faster.
- Table 1 puts this grade at 55 % solids and 600 cSt.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS not required — "Adhesion promoters are typically not required." For applications that require electroplating, the datasheet recommends pre-treating the substrate with HMDS Primer, and its Plating process lists HMDS as the first step.1
Soft bake
- Soft bake
- 100 °C (95–105 °C) · hotplate
- Notes
- 100 °C on a level hotplate is the recommended temperature, with 95-105 °C also usable. Convection ovens are advised against — a skin forms on the resist and traps solvent. Time is published as a thickness-binned table and this grade's 10-27 µm span crosses three bins: 5 min for 5-11 µm, 7 min for 12-20 µm and 12 min for 21-30 µm, so the bake follows the film you actually coat. The datasheet's own tuning method is to bake, cool to room temperature, and return the wafer to the hotplate — if the film wrinkles, it needs longer.
SOURCE: Soft Bake section and Table 2, p.2 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Exposure dose
KMPR 1010's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose is published against film thickness rather than against the grade, so it follows the coating: 235-335 mJ/cm² for a 5-11 µm film, 355-485 for 12-20 µm and 500-645 for 21-30 µm. Doses climb on reflective substrates — the datasheet's multipliers run 1.5× on glass, Pyrex and ITO and 1.5-2× on gold, aluminium, copper, nickel and titanium against 1× on silicon.
- Post-exposure bake
- 100 °C (95–105 °C) · hotplate
| Film thickness | Dose |
|---|---|
| 5–11 µm | 235–335 mJ/cm² |
| 12–20 µm | 355–485 mJ/cm² |
| 21–30 µm | 500–645 mJ/cm² |
SOURCE: KMPR 1000 datasheet
Table 3 'Exposure Dose' of the KMPR 1000 datasheet (Ver. 6). The three bins carried here are the ones this grade's thickness range crosses. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Method
- immersion, spray or spray-puddle
- Rinse
- After TMAH, spray rinse with de-ionized water for 20 s and blow dry with filtered air or nitrogen. After SU-8 developer, spray with fresh developer for about 10 s, then isopropyl alcohol for another 10 s, then blow dry — a white film during the IPA rinse means the film is under-developed and needs more developer.
- Developer family
- TMAH or solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development and Rinse and Dry sections with Tables 6 and 7, p.3-4 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- "Excellent dry etch resistance" (Features, p.1); the series is positioned for DRIE work, and the datasheet's own example shows 10 µm features etched to 65 µm deep.
- Stripper
- Remover PG (NMP) at 80 °C for 10-20 min by immersion, provided the film was never hard baked. Plasma removal where needed: RIE at 200 W with 80 sccm O2 and 8 sccm CF4, 100 mTorr, 10 °C.
- Storage
- Store frozen at -10 °C (14 °F) in tightly closed upright containers, away from light, heat, acids and ignition sources. Shelf life is thirteen months frozen, typically one to two months at room temperature. Defrost at room temperature for 24 h before use.
Where it's used
Practical notes from the datasheet
KMPR 1010 is the step up from KMPR 1005 in Kayaku's chemically amplified epoxy negative series, coating 10 to 27 µm where 1005 stops near 9.5. The series is built for thick, vertical-walled masks that survive plating baths and dry etching and then come off again — which is the distinction from SU-8, whose cross-linked film is notoriously hard to strip. Almost every process number on this datasheet is keyed to film thickness rather than to the grade, so the grade choice really only decides which part of those tables you land in: across 10-27 µm that means a 5, 7 or 12 min soft bake, 235-645 mJ/cm², a 2 or 3 min post-exposure bake and 3-6 min in TMAH. Two things decide whether the result is usable. The post-exposure bake is not optional — it is where cross-linking happens, and the visible latent image after a minute on the hotplate is the built-in check that exposure was right. And hard baking is explicitly discouraged for plating work: an un-hard-baked film swells and lifts in Remover PG, while a baked one becomes much harder to strip.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for KMPR 1010, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
My KMPR 1010 film wrinkles when I put it back on the hotplate after soft bake. Is it underbaked?
Yes — that is the datasheet's own dryness test. Bake at 100 °C (95–105 °C also works) on a level hotplate, not in a convection oven, where a skin can trap solvent. KMPR 1010 runs about 10–27 µm, so its time depends on where your spin lands: 5 min for 5–11 µm, 7 min for 12–20 µm, 12 min for 21–30 µm. If the film wrinkles after a cool-down and re-heat, leave it a few more minutes and repeat until it no longer does when first placed on the plate.
SOURCE: Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Figure 1, Soft Bake, note and Table 2 Soft Bake Times, p.2
I developed KMPR 1010 in SU-8 developer and a white film appeared in the IPA rinse. What is it?
The substrate is underdeveloped. When using SU-8 developer, the rinse is a ~10 s spray of fresh developer then ~10 s of IPA; a white film at the IPA step means undissolved resist remains. Immerse or spray with SU-8 developer again and repeat the rinse. The SU-8 developer times are 2 min up to 30 µm, which covers all of KMPR 1010; with 2.38 % TMAH instead, the times are 3–6 min for this range and the rinse is DI water.
SOURCE: Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Tables 6–7, Rinse and Dry and note, p.4
KMPR 1010 won't strip after plating. Did the hard bake cause it?
It can. The easy strip route in the datasheet applies to KMPR processed without a hard bake, and a hard bake is not required nor recommended for plating resistance. Unbaked KMPR 1000 swells, lifts and strips in Remover PG heated to 80 °C, with substrates immersed 10–20 min depending on thickness and agitation (ultrasound helps). Kayaku's recommended sequence is Remover PG for 10 min at 80 °C, a DI water rinse, then plasma removal if required (RIE 200 W, 80 sccm O₂, 8 sccm CF₄, 100 mTorr, 10 °C).
SOURCE: KMPR 1000 Technical Data Sheet
Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Plating note, Removal, Process Recommendation and Plasma Removal, p.4
KMPR 1010 sidewalls come out sloped. What exposure changes does Kayaku suggest?
Filter out the UV below 350 nm. For vertical KMPR 1000 sidewalls Kayaku recommends a long-pass filter (PL-360LP), which increases the exposure time needed by roughly 40 %. Rebuild the dose from the thickness row your film is in: 235–335 mJ/cm² for 5–11 µm, 355–485 for 12–20 µm, 500–645 for 21–30 µm on silicon. i-line (365 nm) is the recommended wavelength, and an exposure matrix is how the datasheet expects you to optimize.
SOURCE: KMPR 1000 Technical Data Sheet
Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Processing Guidelines, p.1; Exposure and Table 3 Exposure Dose, p.3
Sources & disclaimer
- Kayaku Advanced Materials — KMPR 1010 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
- "Substrate Preparation", pp.1–2, and "Plating", p.4.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.