https://nanyte.com/photoresists/kmpr-1035 · last updated 2026-09-28
- Manufacturer
- Kayaku Advanced Materials
- Tone
- negative
- Chemistry
- Epoxy (SU-8 type)
- Thickness
- 28–115 µm
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Applications
- High aspect ratio · MEMS structural · Electroplating / molding · Etch mask
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm | Published dose |
|---|---|---|---|
| KMPR 1035 | 1000 | 115 | — |
| 2000 | 56 | — | |
| 3000 | 37 | 665–1055 mJ/cm² · 31–55 µm row | |
| 4000 | 28 | 500–645 mJ/cm² · 21–30 µm row within 10 % of a bracket edge |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Published dose is the datasheet’s own thickness bracket, quoted as printed — the full table and its citation are in the exposure section. A thickness the table does not cover shows nothing, and a thickness within 10 % of a bracket edge shows every bracket it could fall in.
read from figure — the filled-square trace legended KMPR 1035 on Figure 1, 'KMPR 1000 Thickness vs. Spin Speed', p.2, the highest of the five traces. Four plotted markers; no numeric table accompanies the chart.
- The steepest trace on the chart by a wide margin: 115 µm at 1000 rpm less than halves to 55.5 µm at 2000, then falls to 36.5 and 28 µm.
- Thickness is therefore extremely sensitive to speed at the slow end, and the 1000 rpm point also sits above the 110 µm the datasheet quotes as the series maximum — treat anything past about 80 µm as a target to establish on a test wafer, not to read off a curve.
- Table 1 puts this grade at 65 % solids and 8400 cSt, the most viscous in the line.
- The recommended program is a 500 rpm / 5-10 s spread at 100 rpm/s acceleration, then 30 s at the final speed at 300 rpm/s, dispensing 1 ml of resist per inch of substrate diameter.
- Adhesion
- HMDS not required — "Adhesion promoters are typically not required." For applications that require electroplating, the datasheet recommends pre-treating the substrate with HMDS Primer, and its Plating process lists HMDS as the first step.1
Soft bake
- Soft bake
- 100 °C (95–105 °C) · hotplate
- Notes
- 100 °C on a level hotplate, with 95-105 °C also usable. Convection ovens are advised against — a skin forms and traps solvent, which on the thickest film in the line is the failure this warning is really about. Time is thickness-binned: 12 min for 21-30 µm, 15 min for 31-55 µm and 20 min for 56-80 µm. Above 80 µm the table stops, so most of this grade's upper range has no published bake time at all. Bake, cool to room temperature, then return the wafer to the hotplate — visible wrinkling means it needs longer, and here that check matters more than anywhere else in the series.
SOURCE: Soft Bake section and Table 2, p.2 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Exposure dose
KMPR 1035's dose is published against film thickness, not as a single number. Read the row for the film you coat and run a dose array around it.
- As published
- Dose follows the coating rather than the grade: 500-645 mJ/cm² at 21-30 µm rising to 1070-1465 mJ/cm² at 56-80 µm, with nothing published above 80 µm — which on this grade means no published dose for anything coated slower than roughly 1500 rpm. Reflective substrates cost more again, at 1.5× on glass, Pyrex and ITO and 1.5-2× on gold, aluminium, copper, nickel and titanium against 1× on silicon.
- Post-exposure bake
- 100 °C (95–105 °C) · hotplate
| Film thickness | Dose |
|---|---|
| 21–30 µm | 500–645 mJ/cm² |
| 31–55 µm | 665–1055 mJ/cm² |
| 56–80 µm | 1070–1465 mJ/cm² |
SOURCE: KMPR 1000 datasheet
Table 3 'Exposure Dose' of the KMPR 1000 datasheet (Ver. 6). The three bins carried here are the ones this grade's thickness range crosses; the table's top bin ends at 80 µm, well below the 115 µm this grade reaches at 1000 rpm. The table is not attributed to a specific wavelength.
Development
- Developer
- 2.38 % TMAH (0.26 N) aqueous alkaline developer; SU-8 developer (solvent) may be used instead
- Method
- immersion, spray or spray-puddle
- Rinse
- After TMAH, spray rinse with de-ionized water for 20 s and blow dry with filtered air or nitrogen. After SU-8 developer, spray with fresh developer for about 10 s, then isopropyl alcohol for another 10 s, then blow dry — a white film during the IPA rinse means the film is under-developed and needs more developer.
- Developer family
- TMAH or solvent
Not published for this resist: Dilution, Time — characterize on-tool.
SOURCE: Development and Rinse and Dry sections with Tables 6 and 7, p.3-4 of the KMPR 1000 datasheet (Ver. 6, December 2019)
Hard bake, etch & strip
- Hard bake
- Not published — characterize on-tool
- Descum
- RIE, 2 min at 100 W with 10 sccm O2 at 100 mTorr — quoted as step 3 of the datasheet's plating sequence.
- Etch resistance
- "Excellent dry etch resistance" (Features, p.1); the series is positioned for DRIE work, and the datasheet's own example shows 10 µm features etched to 65 µm deep.
- Stripper
- Remover PG (NMP) at 80 °C for 10-20 min by immersion, provided the film was never hard baked — on the thickest grade in the line expect the long end and use ultrasound. Plasma removal where needed: RIE at 200 W with 80 sccm O2 and 8 sccm CF4, 100 mTorr, 10 °C.
- Storage
- Store frozen at -10 °C (14 °F) in tightly closed upright containers, away from light, heat, acids and ignition sources. Shelf life is thirteen months frozen, typically one to two months at room temperature. Defrost at room temperature for 24 h before use.
Where it's used
Practical notes from the datasheet
KMPR 1035 is the thickest and most viscous grade in Kayaku's chemically amplified epoxy negative line, reaching over 100 µm in a single coat — the regime of tall copper pillars and deep DRIE masks. It replaced KMPR 1050 in the current revision of the datasheet, which is the first thing to check if you are working from an older process: 1050 no longer appears, and 1035 is thinner at the same spin speed. The honest caution on this grade is where the published process runs out. Its curve reaches 115 µm at 1000 rpm, but the soft-bake, exposure and develop tables all stop at 80 µm, so above that there is no published bake time, no clearing dose and no develop time — only the post-exposure bake table, whose top row is open-ended, still applies. In practice that means the curve crosses 80 µm at roughly 1500 rpm, so anything coated slower than that has to be characterised on-tool. Below 80 µm the rest of the series discipline holds: the post-exposure bake is where cross-linking happens and is not optional, reflective substrates need 1.5-2× the dose, and hard baking is discouraged because an un-hard-baked film is the one that strips in Remover PG.
Grades in this family
Other grades in the KMPR 1000 series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for KMPR 1035, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
The thick end of KMPR 1035's spin range is beyond the process tables. How do I set up a 100 µm coat?
KMPR 1035 runs from about 28 µm at 4000 rpm to about 115 µm at 1000 rpm, while the soft-bake, dose and develop tables end at 56–80 µm and the series is quoted as coating 4–110 µm. So between 2000 rpm (about 55 µm) and 1000 rpm the film leaves the published rows. The 56–80 µm row is the nearest anchor — 20 min soft bake at 100 °C, 1070–1465 mJ/cm², 8 min TMAH or 4 min SU-8 developer — with PEB at 4 min from 50 µm up. Confirm each step on the wafer: wrinkle test, then latent image in PEB.
SOURCE: KMPR 1000 Technical Data Sheet
Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Description, p.1; Figure 1 and Table 2, p.2; Tables 3 and 5, p.3; Tables 6–7, p.4
I took KMPR 1035 straight from the freezer to the spinner. Is that a problem?
It skips a step: the datasheet says to defrost KMPR 1000 at room temperature for 24 hours before use, so plan a day ahead. Storage is frozen at −10 °C (14 °F), upright and tightly closed, away from light, heat, acids and ignition sources; that gives a thirteen-month shelf life from manufacture, against typically only one to two months at room temperature.
SOURCE: Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Storage, p.4
Thick KMPR 1035 structures are lifting at the edges. What does Kayaku say about substrate prep?
Start with a clean, dry substrate. The recommended clean is piranha (H₂SO₄ + H₂O₂) followed by a DI water rinse; RIE or a barrel asher with O₂ also works. KMPR 1000 is described as having excellent adhesion and adhesion promoters are typically not required — except for electroplating, where an HMDS primer pretreatment is recommended.
SOURCE: Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Description and Substrate Preparation, p.1–2
Does KMPR 1035 need a longer post-exposure bake than the thinner grades?
Yes, because PEB time follows film thickness: 3 min at 100 °C for 25–50 µm and 4 min at 50 µm and above (95–105 °C also usable). Nearly all of KMPR 1035's range sits in those two rows, whereas the thin grades mostly use the 2 min row. The bake is required, not optional — it completes the curing reaction — and should start directly after exposure. A mask image should be visible after 1 min; if not, exposure, temperature or both were short.
SOURCE: KMPR 1000 Technical Data Sheet
Kayaku KMPR 1000 Technical Data Sheet, Ver. 6, Dec 2019 — Figure 1, p.2; Post Exposure Bake (PEB), note and Table 5 PEB Times, p.3
Sources & disclaimer
- Kayaku Advanced Materials — KMPR 1035 datasheet (Ver. 6, December 2019 (printed in the footer of every page)) · accessed 2026-09-10
- "Substrate Preparation", pp.1–2, and "Plating", p.4.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.