https://nanyte.com/photoresists/nr7-1500py · last updated 2026-07-26
- Manufacturer
- Futurrex, Inc.
- Tone
- negative
- Thickness
- 1.2–3 µm
- Exposure dose
- 390 mJ/cm² at 365 nm
- Applications
- Lift-off · Etch mask
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| NR7-1500PY | 800 | 3.0 |
| 1000 | 2.7 | |
| 2000 | 1.9 | |
| 3000 | 1.5 | |
| 4000 | 1.3 | |
| 5000 | 1.2 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool.
numeric table 'Film thickness after 150°C hotplate bake for 60 s. / Coating spin speed, 40 s spin (rpm): (nm)', p.1 of Futurrex NR7-1500PY Technical Information (the vendor's own product datasheet page, embedded as p.3 of the retrieved PDF). The datasheet publishes each point as an nm RANGE, not a single value (e.g. 800 rpm -> 2850-3150 nm); each point above is the exact midpoint of that stated range, converted nm->um. Raw ranges: 800rpm=2850-3150nm, 1000rpm=2565-2835nm, 2000rpm=1805-1995nm, 3000rpm=1425-1575nm, 4000rpm=1235-1365nm, 5000rpm=1140-1260nm. These six ranges are numerically identical, rpm-for-rpm, to the published spin table for the sibling Futurrex grade NR9-1500PY — plausibly one master curve reused across product lines formulated to the same nominal reference thickness. The 3000 rpm midpoint (1500 nm = 1.5 um) matches the '1500' in the product name NR7-1500PY, corroborating the midpoint reading.
- The retrieved PDF is a University of Pennsylvania INRF lab SOP (Richard Chang / Ngoc Thanh Pham, Summer 2008) that embeds one page of Futurrex's own 'NEGATIVE RESIST NR7-1500PY' Technical Information sheet as a reference appendix (p.3 of the PDF = the vendor's own page '1').
- Only that one vendor page was retrievable; the vendor's usual second 'Processing' page (with step-by-step spin/EBR/softbake/PEB/develop instructions, present in this library's NR9-1500PY and NR71-3000P entries) was not part of this document, so no Futurrex-stated dispense volume, acceleration, or edge-bead-removal procedure is recorded here.
- Separately, the UPenn SOP itself (pp.1-2 of the PDF, a lab procedure, NOT a Futurrex-published figure) reports its own campus recipe: HMDS primer spun at 3000 rpm/30 s (425 rpm/s accel) then baked 90°C/3 min hotplate before coating
- NR7-1500PY spun at 800 rpm/40 s, softbake 150°C/60 s (hotplate) — this line matches the vendor Properties-table bake condition exactly — exposure '2 mins (MA6)' aligner, post-exposure bake 100°C/2 min hotplate, develop with MF-319 for 10 s, yielding 1.5 µm
- hard-bake 90°C oven/20 min is called optional.
- Those lab-specific numbers (PEB temp/time, develop time, developer choice, exposure dose-as-time-on-a-specific-tool) are quoted here as one university lab's own process on one specific aligner (Karl Suss MA6), not as Futurrex recommendations — the two should not be conflated.
- Adhesion
- HMDS not required — Not addressed on the retrieved vendor page (the vendor's Substrate Preparation guidance, if any, would be on the missing Processing page).
Soft bake
- Soft bake
- 150 °C · 60 s · hotplate
- Notes
- Sourced from the Properties-table heading itself ('Film thickness after 150°C hotplate bake for 60 s.'), which functions as the bake condition Futurrex measured its spin-curve thickness against — the same pattern used on this library's sibling NR9-1500PY and NR71-3000P sheets, where the identical phrase is explicitly corroborated by a numbered Processing step.
SOURCE: Properties table heading, p.1 of Futurrex NR7-1500PY Technical Information (embedded as p.3 of the retrieved PDF)
Exposure dose
The manufacturer publishes 390 mJ/cm² at 365 nm. Dose scales with film thickness and depends on your optics, so treat it as a starting point and run a dose array.
- Dose at 365 nm
- 390 mJ/cm²
- Dose at 405 nm
- Not published — characterize on-tool
- As published
- 390 mJ/cm² at 365 nm is a sensitivity normalized to a 1 µm film, quoted alongside the tools Futurrex expects — steppers, scanning projection aligners, proximity and contact printers — with no dose for any other coat thickness.
SOURCE: Properties, p.1 of Futurrex NR7-1500PY Technical Information (embedded as p.3 of the retrieved PDF)
Development
Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.
Hard bake, etch & strip
- Etch resistance
- "Superior selectivity in RIE process" (Description, p.1 of the Futurrex NR7-1500PY Technical Information excerpt).
- Stripper
- Resist Remover RR4 (Description, p.1: 'easy resist removal in Resist Remover RR4') — note this differs from the RR5 remover specified for Futurrex's NR9-1500PY and the RR41 remover specified for NR71-3000P elsewhere in this library; the three SKUs' strip chemistries should not be conflated.
- Storage
- "Guaranteed shelf life at 25°C storage (years) 3" (Properties, p.1); "shelf life exceeding 3 years at room temperature storage" (Description, p.1) of the Futurrex NR7-1500PY Technical Information excerpt.
Not published for this resist: Hard bake, Descum — characterize on-tool.
Where it's used
Practical notes from the datasheet
NR7-1500PY is Futurrex's negative-tone, 365 nm lift-off resist, formulated in cyclohexanone (24-28% solids) and developed in an unspecified 'basic water solution'; the datasheet's headline advantage is 'easy adjustment of the degree of resist undercut as a function of exposure energy', which is what makes its negative-sloping sidewall profile useful for lift-off. Only one page of Futurrex's own two-page Technical Information sheet was retrievable — embedded as a reference appendix inside a 2008 University of Pennsylvania INRF cleanroom SOP rather than fetched as a standalone vendor PDF — so the vendor's own Processing-page guidance (PEB temperature/time, develop time, edge-bead removal, storage conditions) is not available here and no value is quoted for those steps; the SOP's own campus recipe for them is quoted in the coating and development notes as one lab's process on one aligner (Karl Suss MA6), not as a Futurrex-published figure. The spin-thickness table that IS available reproduces exactly the same six rpm/nm-range data points published for the sibling grade NR9-1500PY elsewhere in this library. The 390 mJ/cm² sensitivity at 365 nm is normalized to a 1 µm-thick film, and resist removal uses Resist Remover RR4 — a third distinct remover code, alongside RR5 (NR9-1500PY) and RR41 (NR71-3000P), that should not be conflated across the three Futurrex SKUs in this library.
Sources & disclaimer
- Futurrex, Inc. — NR7-1500PY datasheet · accessed 2026-07-10
- https://www.seas.upenn.edu/~nanosop/documents/NR7-1500PY.pdf — Pages 1-2 of this SAME PDF (as distinct from page 3, the appended vendor sheet used as datasheetUrl basis): a University of Pennsylvania INRF ('Negative Resist NR7-1500PY photolithography', Richard Chang / Ngoc Thanh Pham, Summer 2008) cleanroom lab SOP. Used only for practical/lab-specific process numbers not present on the retrieved vendor page — HMDS pretreatment step, PEB temp/time, develop time and developer product, hard-bake — each explicitly flagged in the relevant field's notes as one lab's own recipe, not a Futurrex-published recommendation. Not used for any headline vendor spec (spin table and 365 nm dose both come from the appended Futurrex Technical Information page itself).
- Renkes et al.. Plasmonic Nanopore Sensing to Probe the DNA Loading Status of Adeno-Associated Viruses. Chemosensors (2025). doi:10.3390/chemosensors13120418Coats wafers with NR7-1500PY, patterns them on a backside mask aligner, develops in Futurrex RD-6 with an oxygen-plasma descum, then lifts off a 5 nm Cr / 100 nm Au stack to form the plasmonic apertures of a nanopore sensor.
- Zhang et al.. Proteomics-Empowered Microfluidic-SERS Immunoassay for Identifying and Detecting Biomarkers of Micropapillary Lung Adenocarcinoma. Advanced Science (2025). doi:10.1002/advs.202501336Spins NR7-1500PY on a glass wafer at 1200 rpm for 10 s then 3000 rpm for 40 s, bakes at 150 C for 1 min, exposes on a SUSS MicroTec aligner, post-bakes at 120 C for 2 min, develops in TMAH for 7 s, and lifts off Cr/Au overnight to form ring electrodes.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.