https://nanyte.com/photoresists/lor-10b · last updated 2026-09-28
- Manufacturer
- MicroChem (MCC) — now Kayaku Advanced Materials
- Tone
- Not photoimageable (underlayer)
- Chemistry
- Ancillary (not photoimageable)
- Thickness
- 0.7–1.6 µm
- Exposure dose
- Not exposed — dissolves in developer
- Developer
- 0.24N TMAH or a metal-ion-bearing developer (no product named); 0.26N TMAH has some compatibility (selection guide, p.7).
- Applications
- Lift-off
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Underlayer
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| LOR 10B | 1000 | 1.6 |
| 1500 | 1.2 | |
| 2000 | 1.0 | |
| 2500 | 0.83 | |
| 3000 | 0.72 | |
| 3500 | 0.67 | |
| 4000 | 0.65 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
read from figure — the light-blue filled-diamond trace legended LOR 10B on the 'Thickness vs. Spin Speed - LOR B Thick Series' chart, p.5. Seven plotted markers at 500 rpm intervals; no numeric table accompanies the chart.
- The curve runs 15,700 Å at 1000 rpm down to 6,500 Å at 4000 rpm and is nearly flat above 3000 rpm, so speed stops being a useful control below about 0.7 µm — the grade below is the better answer there.
- A convenient landmark: 1.00 µm falls at 2000 rpm, near the middle of the usable range.
- Coating parameters are published for the product line rather than per grade: 5 ml dispensed dynamically over 3-5 s onto a 150 mm wafer at 300-500 rpm, 10,000 rpm/s acceleration to a 3,000 rpm terminal speed, 45 s spin, with EBR PG for edge-bead and whisker removal.
- Adhesion
- HMDS not required — "Primers, such as HMDS, are typically not required" when LOR/PMGI is used as recommended; the datasheet describes excellent adhesion across semiconductor substrates. To dehydrate the surface first, bake at 200 °C for 5 min. LOR/PMGI is virtually insoluble in typical photoresist solvents, so a properly baked underlayer does not intermix with the imaging resist above it.
Soft bake
- Soft bake
- 160–210 °C · hotplate
- Notes
- This is the grade the datasheet actually characterises: Figure 5a plots undercut rate against soft-bake temperature and Figure 5b plots it against soft-bake time, both measured on LOR 10B. The recommended prebake range for the product line is 160-210 °C, hotplate preferred, and some PMGI products bake as high as 280 °C. The text singles out prebake temperature as the greatest influence on undercut rate, ahead of prebake time, developer choice, develop mode and — particularly — develop time. Neither figure is reduced to a table, so the curves give direction and shape rather than a number to dial in: hotter and longer both slow the dissolution and tighten the undercut. No single recommended prebake temperature or time is published for this or any other grade.
SOURCE: Rev. D p.3: 'The recommended bake temperature range is 160°C –…
Rev. D p.3: 'The recommended bake temperature range is 160°C – 210°C'; 'Hot plates are the preferred tool for the prebake step.'
Exposure
LOR 10B is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.
Development
- Developer
- 0.24N TMAH or a metal-ion-bearing developer (no product named); 0.26N TMAH has some compatibility (selection guide, p.7).
- Developer family
- TMAH or buffered alkaline
Not published for this resist: Dilution, Time, Method, Rinse — characterize on-tool.
SOURCE: Product description, the LOR/PMGI process-flow section and the…
Product description, the LOR/PMGI process-flow section and the product selection guide, Kayaku "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023)
Hard bake, etch & strip
- Stripper
- Remover PG. EBR PG removes edge beads and whiskers and is also an effective spin-bowl cleaner and a rework solvent for unbaked wafers.
- Storage
- Store upright in original sealed containers in a dry area between 10 and 24 °C (50-76 °F), away from ignition sources, light, heat, oxidants, acids and reducers. Do not use after the expiration date, 13 months from manufacture.
Not published for this resist: Hard bake, Descum, Etch resistance — characterize on-tool.
Where it's used
Practical notes from the datasheet
LOR 10B is a PMGI-based sacrificial underlayer from the fast-dissolving B series, and it is the grade worth knowing about even if you end up buying a different one: every published undercut measurement on this datasheet was made on LOR 10B. Figures 5a and 5b show undercut rate against prebake temperature and against prebake time, and the text singles out temperature as the strongest influence. No other grade gets that treatment, so anyone tuning an A or C grade is reading a B-grade curve and scaling by judgement. On thickness it sits in the middle of the B line at 0.65-1.57 µm. The B series dissolves faster than A for the same prebake, which is right when the deposited metal is thick and needs a generous ledge to break at, and wrong when the feature is fine — the undercut keeps running for as long as the imaging resist above is developing, and develop time is the variable the datasheet flags as especially influential.
Grades in this family
Other grades in the LOR B series line differ mainly in coating thickness:
Troubleshooting
Common failure modes for LOR 10B, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Undercut on LOR 10B is running away. Should I lengthen the prebake or raise its temperature?
Raise the temperature. Figure 5a, measured on 10B, fits the undercut rate as 215.56 − T nm/s over 170-190 °C: about 46 nm/s at 170 °C, 36 at 180 °C and 26 at 190 °C. Figure 5b fits bake time as 46.25 − 0.0208·t nm/s, only about 43 nm/s at 160 s falling to 38 at 380 s. So 20 °C of bake moves the rate by roughly 20 nm/s, while more than doubling the bake time moves it by about 5. The developer and develop mode behind those figures are not stated, so treat the absolute rates as a starting point.
SOURCE: Kayaku Advanced Materials, "LOR and PMGI Resists" technical…
Kayaku Advanced Materials, "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023) — Soft-Bake/Prebake Process and Figures 5a-5b, p.3
Same LOR 10B recipe, different undercut from one lot of wafers to the next. What drifts?
Start with the hotplate. On the Figure 5a fit the 10B undercut rate falls about 1 nm/s for every 1 °C of prebake, so a plate that wanders a few degrees shows up directly in the ledge. Then check develop time and mode, which the datasheet also names; the room, which it wants at 20-25 °C ±1 °C and 35-45 % RH ±2 %; and the bottle, which should be stored upright and sealed at 10-24 °C and not used past its expiry, 13 months from manufacture.
SOURCE: Kayaku Advanced Materials, "LOR and PMGI Resists" technical…
Kayaku Advanced Materials, "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023) — Soft-Bake/Prebake Process and Figure 5a, p.3; Storage and Processing Environment, p.8
Which developer gives a controlled undercut on LOR 10B?
The selection guide recommends 0.24N TMAH and MIB developers for the B series and rates standard 0.26N TMAH only as some compatibility. For a 0.5-1.0 µm undercut it adds that control is achievable with weaker MIF developers or typical MIB developers. If the imaging resist on top of 10B calls for 0.26N, expect to tune develop time and prebake harder.
SOURCE: Kayaku Advanced Materials, "LOR and PMGI Resists" technical…
Kayaku Advanced Materials, "LOR and PMGI Resists" technical data sheet, Rev. D (August 2023) — Development Process, p.4; Product Selection Guide (Developer Compatibility, Undercut Geometry, Advice note 1), p.7
Sources & disclaimer
- MicroChem (MCC) — now Kayaku Advanced Materials — LOR 10B datasheet (Rev. D, August 2023 (printed in the footer of every page)) · accessed 2026-09-10
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-09-28.